! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
R44E.pdf
Dec.17,2012
Temperature Sensor Thermo String/Lead Type ! Caution/Notice
c ! Caution (Storage and Operating Conditions)
This product is designed for application in an
ordinary environment (normal room temperature,
humidity and atmospheric pressure).
Do not use under the following conditions because
all of these factors can deteriorate the product
characteristics or cause failures and burn-out.
1. Corrosive gas or deoxidizing gas
(Chlorine gas, Hydrogen sul?de gas, Ammonia gas,
Sulfuric acid gas, Nitric oxide gas, etc.)
c ! Caution (Others)
Be sure to provide an appropriate fail-safe function
on your product to prevent secondary damages that may be
c Notice (Storage and Operating Conditions)
To keep solderability of product from declining, the
following storage condition is recommended.
1. Storage condition:
Temperature -10 to +40 degrees C
Humidity less than 75%RH (not dewing condition)
2. Storage term:
Use this product within 6 months after delivery by
?rst-in and ?rst-out stocking system.
c Notice (Rating)
Use this product within the speci?ed temperature
range.
c Notice (Soldering and Mounting) NXF Series
Please note as shown below when you mount this product.
1. Do not melt solder in the resin head when you solder
this product. If you do so, it has a possibility of wire break,
electric short mode failure and wire coating break.
In case you cut the lead wire of this product less than
20mm from the resin head, the heat of the melted solder
at the lead wire edge is propagated easily to the resin
head along the lead wire.
2. Do not touch the resin head directly with the soldering
iron. It may cause the melting of solder in the resin head.
c Notice (Soldering and Mounting) NXR Series
Please notice as shown below when you mount this product.
1. Do not melt the solder in resin head, when you solder
this product. If you melt the solder in resin head,
it has posibility that the break of wire and short.
In case you cut the lead wire of this product less
than 8mm from resin head, the heat of melted solder
at lead wire edge is propagated easily to the resin
c Notice (Handling)
1. The ceramic element of this product is fragile, and
care must be taken not to load an excessive
press-force or not to give a shock at handling.
Such forces may cause cracking or chipping.
2. Volatile or ?ammable gas
3. Dusty conditions
4. Under vacuum, or under high or low pressure
5. Wet or humid locations
6. Places with salt water, oils, chemical liquids or
organic solvents
7. Strong vibrations
8. Other places where similar hazardous conditions
exist
caused by the abnormal function or the failure of our
product.
3. Handling after unpacking:
After unpacking, reseal product promptly or
store it in a sealed container with a drying agent.
4. Storage place:
Do not store this product in corrosive gas
(Sulfuric acid gas, Chlorine gas, etc.) or in direct
sunlight.
Higher temperature may cause deterioration of the
characteristics or the material quality of this product.
3. Do not separate the parallel lead wires 10mm or less
from the resin head, when you separate parallel lead
wires.
4. If you mold this product by resin, please evaluate
the quality of this product before you use it.
5. Do not bend the lead wire radius 1mm or less when
you bend the lead wire.
head along the lead wire. Please do not cut below
this product 9mm.
2. Do not touch the resin head directly by solder iron.
It may cause the melt of solder in resin head.
3. If you mold by resin this product, please evaluate
the qualityl of this product before you use it.
2. Do not apply an excessive force to the lead.
Otherwise, it may cause junction between lead and
element to break or crack. Holding element by side
lead wire is recommended when lead wire is bent or
cut.
31
相关PDF资料
NCT65DMR2G IC TEMP MON TRIP POINT 8-MSOP
NCV8440STT1G MOSFET N CH 2.6A 59V SOT-223-4
NDB5060L MOSFET N-CH 60V 26A D2PAK
NDB6060 MOSFET N-CH 60V 48A TO-263AB
NDB7060 MOSFET N-CH 60V 75A D2PAK
NDC7001C MOSFET N+P 60V 340MA SSOT6
NDC7002N_SB9G007 MOSFET N-CH DUAL 50V 6-SSOT
NDC7003P MOSFET 2P-CH 60V 340MA SSOT6
相关代理商/技术参数
NCP15XW682K03RC 功能描述:热敏电阻 - NTC 6.8K OHM 10% RoHS:否 制造商:EPCOS 电阻:10 kOhms 功率额定值:150 mW 容差:2 % 端接类型:Radial 系列:B57703M 工作温度范围:- 55 C to + 125 C
NCP1601 AD09 WAF 制造商:ON Semiconductor 功能描述:
NCP1601ADR2 功能描述:功率因数校正 IC Fixed Frequency RoHS:否 制造商:Fairchild Semiconductor 开关频率:300 KHz 最大功率耗散: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Reel
NCP1601ADR2G 功能描述:功率因数校正 IC Fixed Frequency DCM/CRM PFC RoHS:否 制造商:Fairchild Semiconductor 开关频率:300 KHz 最大功率耗散: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Reel
NCP1601AGEVB 功能描述:BOARD EVAL NCP1601A RoHS:是 类别:编程器,开发系统 >> 评估演示板和套件 系列:* 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:- 主要目的:电源管理,电池充电器 嵌入式:否 已用 IC / 零件:MAX8903A 主要属性:1 芯锂离子电池 次要属性:状态 LED 已供物品:板
NCP1601AP 功能描述:功率因数校正 IC Fixed Frequency RoHS:否 制造商:Fairchild Semiconductor 开关频率:300 KHz 最大功率耗散: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Reel
NCP1601APG 功能描述:功率因数校正 IC Fixed Frequency DCM/CRM PFC RoHS:否 制造商:Fairchild Semiconductor 开关频率:300 KHz 最大功率耗散: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Reel
NCP1601BDR2 功能描述:功率因数校正 IC Fixed Frequency RoHS:否 制造商:Fairchild Semiconductor 开关频率:300 KHz 最大功率耗散: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Reel